PCB Testing

Printed circuit boards or PCBs, have a vital role in the modern day as technology has become essential to our daily routines. These circuit boards are essentially a foundation as they are used in almost everything electronic or electrical. Being at the heart of most electrical devices today, they can come in various configurations which allow them to serve different purposes and provides various capabilities. As technology grows and develops, the need for PCBs will also grow.

Here are the most common causes of PCB failures:
  • Defects (During Assembly)
  • Burnt components (a type of defect)
  • Environmental factors like heat and humidity
  • Soldering issues
  • Human error
  • Old age

We are among only few laboratories in India to carry out PCBA analysis
  • Cross Sectional Analysis
  • Dye and Pry Test
Cross Sectional Analysis

The integrity of circuit boards cannot always be ensured by non-destructive techniques, such as visual and X-ray inspection means. Cross-sectional examination at high magnification would be required for carrying out crack detection, IPC-A-600 inspections, plate thickness measurement, and failure analysis.

Cross-sectioning involves mounting a target segment of the PCB in a potting material to obtain support and protect the sample in the subsequent polishing process. The mounted sample is carefully polished using progressively finer media to reach the target examination plane of interest. The prepared specimen is then examined at various magnifications either under an optical microscope or a scanning electron microscopy (SEM).

We have a strong metallurgical background with highly trained technicians. Generally single sample mounts are most common, we routinely regrind to hit multiple targets in the same mount, or grind from multiple sides when the target orientation requires it.

Dye and Pry Test

The Dye and Pull Test, formerly known as Dye and Pry, is designed to detect cracks in Ball Grid Arrays (BGA), though it can be effective on other surface mounted components such as QFNs or DFNs. Detected cracks are then mapped and categorized for each component.